﻿<?xml version="1.0" encoding="utf-8" standalone="yes"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:trackback="http://madskills.com/public/xml/rss/module/trackback/" xmlns:wfw="http://wellformedweb.org/CommentAPI/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/"><channel><title>BlogJava-先学者为师-随笔分类-硬件组装</title><link>http://www.blogjava.net/kj2ff/category/15297.html</link><description>子曾经曰过：“三人行，必有我师！”，我听老祖宗的话，所以我的身边人都是我的老师。</description><language>zh-cn</language><lastBuildDate>Wed, 28 Feb 2007 04:18:12 GMT</lastBuildDate><pubDate>Wed, 28 Feb 2007 04:18:12 GMT</pubDate><ttl>60</ttl><item><title>内存颗粒TSOP</title><link>http://www.blogjava.net/kj2ff/archive/2006/09/18/70232.html</link><dc:creator>Andy.J（孔吉）</dc:creator><author>Andy.J（孔吉）</author><pubDate>Mon, 18 Sep 2006 02:44:00 GMT</pubDate><guid>http://www.blogjava.net/kj2ff/archive/2006/09/18/70232.html</guid><wfw:comment>http://www.blogjava.net/kj2ff/comments/70232.html</wfw:comment><comments>http://www.blogjava.net/kj2ff/archive/2006/09/18/70232.html#Feedback</comments><slash:comments>0</slash:comments><wfw:commentRss>http://www.blogjava.net/kj2ff/comments/commentRss/70232.html</wfw:commentRss><trackback:ping>http://www.blogjava.net/kj2ff/services/trackbacks/70232.html</trackback:ping><description><![CDATA[TSOP是“Thin Small Outline Package”的缩写，意思是薄型小尺寸封装。TSOP内存是在芯片的周围做出引脚，采用SMT技术（表面安装技术）直接附着在PCB板的表面。TSOP封装外形尺寸时，寄生参数(电流大幅度变化时，引起输出电压扰动) 减小，适合高频应用，操作比较方便，可靠性也比较高。同时TSOP封装具有成品率高，价格便宜等优点，因此得到了极为广泛的应用。TSOP II 是前一种的升级。<img src ="http://www.blogjava.net/kj2ff/aggbug/70232.html" width = "1" height = "1" /><br><br><div align=right><a style="text-decoration:none;" href="http://www.blogjava.net/kj2ff/" target="_blank">Andy.J（孔吉）</a> 2006-09-18 10:44 <a href="http://www.blogjava.net/kj2ff/archive/2006/09/18/70232.html#Feedback" target="_blank" style="text-decoration:none;">发表评论</a></div>]]></description></item></channel></rss>